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features ? improved brightness ? improved color performance ? available in popular t-1 and t-1 3 / 4 packages ? new sturdy leads ? ic compatible/low current capability ? reliable and rugged ? choice of 3 bright colors - high efciency red - high brightness yellow - high performance green applications ? lighted switches ? backlighting front panels ? light pipe sources ? keyboard indicators description these non-difused lamps out-perform conventional led lamps. by utilizing new higher intensity material, we achieve superior product performance. the hlmp -3750/-3390/- 1340 series lamps are gallium arsenide phosphide on gallium phosphide red light emit - ting diodes. the hlmp -3850/-3490/- 1440 series are gal - lium arsenide phosphide on gallium phosphide yellow light emitting diodes. the hlmp -3950/3590/3960/1540/ k640 series lamps are gallium phosphide green light emitting diodes. HLMP-3707, hlmp-3907, hlmp-3750, hlmp-3850, hlmp-3950, hlmp-3960, hlmp-3390, hlmp-3490, hlmp-3590, hlmp-1340, hlmp-1440, hlmp-1540, hlmp-k640 t-13/4 (5 mm), t-1 (3 mm), ultra - bright led lamps data sheet
2 selection guide luminous intensity iv (mcd) @ 20ma package device package description color hlmp- min. typ. max. 2 q 1/2 degree outline t-1 3 / 4 red 3707-l00xx 90.2 - - 24 f 3750 90.2 125.0 - 24 a 3750-l00xx 90.2 125.0 - 24 a yellow 3850 96.2 140.0 - 24 a 3850-k00xx 96.2 140.0 - 24 a 3850-kl0xx 96.2 150.0 294.0 24 a green 3907-k00xx 111.7 - - 24 f 3914-k00xx 111.7 - - 24 d 3950 111.7 265.0 - 24 a 3950-k00xx 111.7 265.0 - 24 a 3950-lm0xx 170.0 300.0 490.0 24 a 3960-k0xxx 111.7 265.0 - 24 e t-1 3 / 4 low profle red 3390 35.2 55.0 - 32 b yellow 3490 37.6 55.0 - 32 b green 3590 43.6 55.0 - 32 b t-1 red 1340 35.2 55.0 - 45 c 1340-h00xx 13.8 - - 45 c 1340-j00xx 35.2 55.0 - 45 c yellow 1440 23.5 45.0 - 45 c 1440-h00xx 23.5 45.0 - 45 c green 1540 27.3 45.0 - 45 c 1540-h00xx 27.3 45.0 - 45 c 1540-ij0xx 43.6 60.0 139.6 45 c emerald green k640 4.2 21.0 - 45 c k640-fgnxx 10.6 20.0 34.0 45 c
3 package dimensions 25.40 (1.00) min. 6.10 (0.240) 5.59 (0.220) 2.54 (0.100) nom. 9.19 (0.362) 8.43 (0.332) 5.08 (0.200) 4.57 (0.180) cathode lead (note 1) 0.89 (0.035) 0.64 (0.025) 1.27 (0.050) nom. 0.65 max. 0.46 (0.018) square nom. package outline "d" hlmp-3914 package outline "e" hlmp-3960 23.0 (0.900) min. 6.10 (0.240) 5.60 (0.220) 9.07 (0.357) 8.56 (0.337) 5.08 (0.200) 4.78 (0.188) 0.89 (0.035) 0.64 (0.025) 1.52 (0.060) 1.02 (0.040) 0.53 (0.021) 0.43 (0.017) 13.11 (0.516) 12.34 (0.486) 1.02 (0.040) max. epoxy meniscus cathode flat package outline "f" HLMP-3707/3907 sq. 2.79 (0.110) 2.29 (0.090) 1.32 (0.052) 1.02 (0.040) (0.026) 12.47 (0.491) 11.71 (0.461) 22.86 (0.900) min. 1.02 (0.040) max. ? 0.74 (0.029) 0.58 (0.023) cathode flat square 0.8 (0.031) 2.54 (0.100) nom. 9.07 (0.357) 8.56 (0.337) 5.08 (0.200) 4.78 (0.188) 0.89 (0.035) 0.64 (0.025) 1.52 (0.060) 1.02 (0.040) 6.10 (0.240) 5.60 (0.220) 0.65 (0.026) max. 24.1(.95) min. 4.70 (.185) 4.19 (.165) 3.43 (.135) 2.92 (.115) 1.52 (.060) 1.02 (.040) 2.79 (.110) 2.29 (.090) 1.14 (.045) 0.51 (.020) (0.022) 0.55 sq. typ. (0.016) 0.40 ? 3.17 (.125) 2.67 (.105) 6.35 (.250) 5.58 (.220) notes: 1. all dimensions are in millimeters (inches). 2. an epoxy meniscus may extend about 1 mm (0.40") down the leads. 3. for pcb hole recommendations, see the precautions section.
4 absolute maximum ratings at t a = 25c parameter red yellow green/emerald green units peak forward current 90 60 90 ma average forward current [1] 25 20 25 ma dc current [2] 30 20 30 ma transient forward current [3] 500 500 500 ma (10 s pulse) reverse voltage (i r = 100 a) 5 5 5 v led junction temperature 110 110 110 c operating temperature range -40 to +100 -40 to +100 -20 to +100 c storage temperature range -40 to +100 -40 to +100 -40 to +100 c notes: 1. see figure 2 to establish pulsed operating conditions. 2. for red and green series derate linearly from 50c at 0.5 ma/c. for yellow series derate linearly from 50c at 0.2 ma/c. 3. the transient peak current is the maximum non-recurring peak current the devices can withstand without damaging the led die and wire bonds. it is not recommended that the device be operated at peak currents beyond the absolute maximum peak forward current. hlmp - x x xx - x x x xx mechanical options 00: bulk 01: tape & reel, crimped leads 02, bx: tape & reel, straight leads a1, b1: right angle housing, uneven leads a2, b2: right angle housing, even leads dx, ex: ammo pack, straight leads fh: 2 iv bin select with inventory control vx: ammo pack, crimped leads color bin options 0: full color bin distribution n: color bin 6 & 7 only maximum iv bin options 0: open (no. max. limit) others: please refer to the iv bin tabl e minimum iv bin options please refer to the iv bin table color options 3, 7: gap her 4, 8: gap yellow (except k4xx series) 5, 9: gap green 6: gap emerald green package option 1, k: t-1 (3 mm) 3: t-1 3 / 4 (5 mm) part numbering system
5 electrical/optical characteristics at t a = 25c t-1 3 / 4 test symbol description t-1 3 / 4 low dome t-1 min. typ. max. units conditions peak peak 37xx 3390 1340 635 nm measurement wavelength 38xx 3490 1440 583 at peak 39xx 3590 1540 565 k640 558 d dominant 37xx 3390 1340 626 nm note 1 wavelength 38xx 3490 1440 585 39xx 3590 1540 569 k640 560 ? 3 / 4 spectral line 37xx 3390 1340 40 nm halfwidth 38xx 3490 1440 36 39xx 3590 1540 28 k640 24 s speed of 37xx 3390 1340 90 ns respond 38xx 3490 1440 90 39xx 3590 1540 500 k640 3100 c capacitance 37xx 3390 1340 11 pf v f = 0, 38xx 3490 1440 15 f = 1 mhz 39xx 3590 1540 18 k640 35 r j-pin thermal 37xx 3390 210 c/w junction to resistance 38xx 3490 210 cathode lead 39xx 3590 210 510 1340 290 1440 290 1540 290 k640 290 v f forward 37xx 3390 1340 1.5 1.9 2.6 v i f = 20 ma voltage 38xx 3490 1440 1.5 2.1 2.6 (figure 3) 39xx 3590 1540 1.5 2.2 3.0 k640 2.2 3.0 v r reverse 37xx 3390 1340 5.0 v i f = 100 a breakdown 38xx 3490 1440 voltage 39xx 3590 1540 k640 v luminous 37xx 3390 1340 145 lumens note 2 efcacy 38xx 3490 1440 500 watt 39xx 3590 1540 595 k640 655 notes: 1. the dominant wavelength, d, is derived from the cie chromaticity diagram and represents the single wavelength which defnes the color of the device. 2. the radiant intensity, ie, in watts per steradian, may be found from the equation ie = iv/ v , where iv is the luminous intensity in candelas and v is the luminous efcacy in lumens/watt.
6 figure 1. relative intensity vs. wavelength. red, yellow, and green figure 4. relative luminous intensity vs. forward current. figure 5. relative efciency (luminous intensity per unit current) vs. peak current. figure 2. maximum tolerable peak current vs. pulse duration. (i dc max as per max ratings). figure 3. forward current vs. forward voltage. high efficiency red wavelength ? nm relative intensity 1.0 0.5 0 0 0 7 0 5 6 0 0 6 0 5 5 0 0 5 yellow emerald green green t = 25 c a
7 figure 6. relative luminous intensity vs. angular displacement. t-1 3 / 4 lamp. figure 7. relative luminous intensity vs. angular displacement. t-1 3 / 4 low profle lamp. figure 8. relative luminous intensity vs. angular displacement. t-1 lamp. intensity range (mcd) color bin min. max. red g 9.7 15.5 h 15.5 24.8 i 24.8 39.6 j 39.6 63.4 k 63.4 101.5 l 101.5 162.4 m 162.4 234.6 n 234.6 340.0 o 340.0 540.0 p 540.0 850.0 q 850.0 1200.0 r 1200.0 1700.0 s 1700.0 2400.0 t 2400.0 3400.0 u 3400.0 4900.0 v 4900.0 7100.0 w 7100.0 10200.0 x 10200.0 14800.0 y 14800.0 21400.0 z 21400.0 30900.0 maximum tolerance for each bin limit is 18%. intensity bin limits
8 lambda (nm) color cat # min. max. emerald green 9 552.5 555.5 8 555.5 558.5 7 558.5 561.5 6 561.5 564.5 green 6 561.5 564.5 5 564.5 567.5 4 567.5 570.5 3 570.5 573.5 2 573.5 576.5 yellow 1 582.0 584.5 3 584.5 587.0 2 587.0 589.5 4 589.5 592.0 5 592.0 593.0 orange 1 597.0 599.5 2 599.5 602.0 3 602.0 604.5 4 604.5 607.5 5 607.5 610.5 6 610.5 613.5 7 613.5 616.5 8 616.5 619.5 maximum tolerance for each bin limit is 0.5 nm. color categories intensity range (mcd) color bin min. max. yellow f 10.3 16.6 g 16.6 26.5 h 26.5 42.3 i 42.3 67.7 j 67.7 108.2 k 108.2 173.2 l 173.2 250.0 m 250.0 360.0 n 360.0 510.0 o 510.0 800.0 p 800.0 1250.0 q 1250.0 1800.0 r 1800.0 2900.0 s 2900.0 4700.0 t 4700.0 7200.0 u 7200.0 11700.0 v 11700.0 18000.0 w 18000.0 27000.0 green/ a 1.1 1.8 emerald b 1.8 2.9 green c 2.9 4.7 d 4.7 7.6 e 7.6 12.0 f 12.0 19.1 g 19.1 30.7 h 30.7 49.1 i 49.1 78.5 j 78.5 125.7 k 125.7 201.1 l 201.1 289.0 m 289.0 417.0 n 417.0 680.0 o 680.0 1100.0 p 1100.0 1800.0 q 1800.0 2700.0 r 2700.0 4300.0 s 4300.0 6800.0 t 6800.0 10800.0 u 10800.0 16000.0 v 16000.0 25000.0 w 25000.0 40000.0 maximum tolerance for each bin limit is 18%. intensity bin limits (continued)
9 mechanical option matrix mechanical option code defnition 00 bulk packaging, minimum increment 500 pcs/bag 01 tape & reel, crimped leads, min. increment 1300 pcs/bag for t-1 3 / 4 , 1800 pcs/bag for t-1 02 tape & reel, straight leads, min. increment 1300 pcs/bag for t-1 3 / 4 , 1800 pcs/bag for t-1 a1 t-1, right angle housing, uneven leads, minimum increment 500 pcs/bag a2 t-1, right angle housing, even leads, minimum increment 500 psc/bag b1 t-1 3 / 4 , right angle housing, uneven leads, minimum increment 500 pcs/bag b2 t-1 3 / 4 , right angle housing, even leads, minimum increment 500 psc/bag bj t-1, tape & reel, straight leads, minimum increment 2000 pcs/bag eg ammo pack, straight leads in 5 k increment fh devices that require inventory control and 2 i v bin select vr ammo pack, crimped leads, min. increment 2 k for t-1 3 / 4 and t-1 note: all categories are established for classifcation of products. products may not be available in all categories. please contact your local avago repre - sentative for further clarifcation/information.
10 precautions: lead forming: ? the leads of an led lamp may be preformed or cut to length prior to insertion and soldering on pc board. ? for better control, it is recommended to use proper tool to precisely form and cut the leads to applicable length rather than doing it manually. ? if manual lead cutting is necessary, cut the leads after the soldering process. the solder connection forms a mechanical ground which prevents mechanical stress due to lead cutting from traveling into led package. this is highly recommended for hand solder operation, as the excess lead length also acts as small heat sink. soldering and handling: ? care must be taken during pcb assembly and soldering process to prevent damage to the led component. ? led component may be efectively hand soldered to pcb. however, it is only recommended under unavoidable circumstances such as rework. the closest manual soldering distance of the soldering heat source (soldering irons tip) to the body is 1.59mm. soldering the led using soldering iron tip closer than 1.59mm might damage the led. ? esd precaution must be properly applied on the soldering station and personnel to prevent esd damage to the led component that is esd sensitive. do refer to avago application note an 1142 for details. the soldering iron used should have grounded tip to ensure electrostatic charge is properly grounded. ? recommended soldering condition: wave manual solder soldering [1],[2] dipping pre-heat temperature 105c max. C pre-heat time 60 sec max. C peak temperature 250c max. 260c max. dwell time 3 sec max. 5 sec max. note: 1. above conditions refers to measurement with thermocouple mounted at the bottom of pcb. 2. it is recommended to use only bottom preheaters in order to reduce thermal stress experienced by led. ? wave soldering parameters must be set and maintained according to the recommended temperature and dwell time. customer is advised to perform daily check on the soldering profle to ensure that it is always conforming to recommended soldering conditions. note: 1. pcb with diferent size and design (component density) will have diferent heat mass (heat capacity). this might cause a change in temperature experienced by the board if same wave soldering setting is used. so, it is recommended to re-calibrate the soldering profle again before loading a new type of pcb. 2. customer is advised to take extra precaution during wave soldering to ensure that the maximum wave temperature does not exceed 250c and the solder contact time does not exceeding 3sec. over-stressing the led during soldering process might cause premature failure to the led due to delamination. ? any alignment fxture that is being applied during wave soldering should be loosely ftted and should not apply weight or force on led. non metal material is recommended as it will absorb less heat during wave soldering process. ? at elevated temperature, led is more susceptible to mechanical stress. therefore, pcb must allowed to cool down to room temperature prior to handling, which includes removal of alignment fxture or pallet. ? if pcb board contains both through hole (th) led and other surface mount components, it is recommended that surface mount components be soldered on the top side of the pcb. if surface mount need to be on the bottom side, these components should be soldered using refow soldering prior to insertion the th led. ? recommended pc board plated through holes (pth) size for led component leads: led component lead size diagonal plated through- hole diameter lead size (typ.) 0.45 0.45 mm (0.018 0.018 in.) 0.636 mm (0.025 in) 0.98 to 1.08 mm (0.039 to 0.043 in) dambar shear- of area (max.) 0.65 mm (0.026 in) 0.919 mm (0.036 in) lead size (typ.) 0.50 0.50 mm (0.020 0.020 in.) 0.707 mm (0.028 in) 1.05 to 1.15 mm (0.041 to 0.045 in) dambar shear- of area (max.) 0.70 mm (0.028 in) 0.99 mm (0.039 in) ? over-sizing the pth can lead to twisted led after clinching. on the other hand under sizing the pth can cause difculty inserting the th led. refer to application note an5334 for more information about soldering and handling of th led lamps. 1.59 mm
11 example of wave soldering temperature profle for th led 0 10 20 30 40 50 60 70 80 90 100 250 200 150 100 50 time (minutes) preheat turbulent wave laminar hot air knife temperature (c) recommended solder: sn63 (leaded solder alloy) sac305 (lead free solder alloy) flux: rosin ?ux solder bath temperature: 245c 5c (maximum peak temperature = 250c) dwell time: 1.5 sec ? 3.0 sec (maximum = 3sec) note: allow for board to be su?ciently cooled to room temperature before exerting mechanical force. recommended solder: sn63 (leaded solder alloy) sac305 (lead free solder alloy) flux: rosin ?ux solder bath temperature: 245c 5c (maximum peak temperature = 250c) dwell time: 1.5 sec ? 3.0 sec (maximum = 3sec) note: allow for board to be su?ciently cooled to room temperature before exerting mechanical force. packaging label: (i) avago mother label: (available on packaging box of ammo pack and shipping box) (1p) ite m: part number (1t) lot: lot number lpn: (9d)mfg date: manufacturing date (p) customer item: (v) vendor id : deptid: made in: country of origin (q) qty: quantity cat: intensity bin bin: color bin (9d) date code: date code standard label ls0002 rohs compliant e3 max temp 250c (1p) part # : part number (1t) lot #: lot number (9d)mfg date: manufacturing date c/o: country of origin customer p/n: supplier code: quantity: packing quantity cat: intensity bin bin: color bin datecode: date code rohs compliant e3 max tem p 250c lam p s bab y label
for product information and a complete list of distributors, please go to our web site: www.avagotech.com avago, avago technologies, and the a logo are trademarks of avago technologies in the united states and other countries. data subject to change. copyright ? 2005-2013 avago technologies. all rights reserved. obsoletes 5989-4254en av02-1556en -june 14, 2013 (ii) avago baby label (only available on bulk packaging) (1p) ite m: part number (1t) lot: lot number lpn: (9d)mfg date: manufacturing date (p) customer item: (v) vendor id : deptid: made in: country of origin (q) qty: quantity cat: intensity bin bin: color bin (9d) date code: date code standard label ls0002 rohs compliant e3 max temp 250c (1p) part # : part number (1t) lot #: lot number (9d)mfg date: manufacturing date c/o: country of origin customer p/n: supplier code: quantity: packing quantity cat: intensity bin bin: color bin datecode: date code rohs compliant e3 max tem p 250c lam p s bab y label

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